Research on SOI Pressure Sensor Packaging Process

Abstract：Aimmy at pressure measuring requirement of gas and liquid in high temperature environment, a new type of SOI (Silicon on Insulator) pressure sensitive chip is fabricated, and a packaging structure of resistance high temperature for the chip is designed.The effects of bonding material on sensor's sisitivity, stress distrabution in chip and relibility of die bonding are analyzed in detail by applied finite element methed, and an optimizing technique is proposed.The results illuminate that Yangshi modul and thickness of die bonding materials have a bigger influence on sensistivity and reliability of sensor.The sensor's properties can be optimized by correct selecting die material.AuSn solder in several die bonding material analyzed is a better die bonding material, is more suited for SOI pressure sensor packaging.The testing results of the packaging samples show that the sensor can achieve the prceision of 0.5%, the pressure range of 30*!Mpa, and temperature of medium is 200*!℃.

Keyword：SOI pressure sensor;Packaging;Die bonding technique;FEM analysis;