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Discussion on the constitutive relation and application of three-dimensional printing semitransparent material
Time: 2021-11-10 Counts:

doi:10.16186/j.cnki.1673-9787.2020040003

Received:2020/04/01

Revised:2020/06/04

Published:2021/11/15

Discussion on the constitutive relation and application of three-dimensional printing semitransparent material

LIU Huabo1, MENG Fanjing1, HUA Shaozhen1, WANG Hao2

1.School of Mechanical Engineering Henan Institute of Technology Xinxiang  453003 Henan China;2.School of Energy Science and Engineering Henan Polytechnic University Jiaozuo  454000 Henan China

Abstract:In order to study the constitutive relationship of three-dimensional printing translucent resin material with different post-processing methods and its application a batch of standard cylinder specimens were pre-pared by laser curing 3D printing technology. The effects of post-treatment methods such as secondary curing time axial loading rate and low temperature freezing on the mechanical properties of translucent resin were studied in addition the uniaxial compression test of the specimen with a internal penny-shaped crack was carried out. It was found that the brittleness of the the 3D printing translucent resin and the elastic modulus of the specimen could be significantly increased by increasing the second curing time and low temperature freezing The loading rate had little effect on the elastic modulus of the specimen but it could increase the yield strength of the specimen. In the uniaxial compression test of the specimen with internal penny-shaped crack the wing crack was observed. The results showed that compared with the traditional casting transparent resin the 3D printing translucent resin specimens were simple to prepare and it could prepare the specimens with complex internal structure but it still lacked in the physical and mechanical properties such as transparency low temperature brittleness etc.

Key words:3D printing;semitransparent resin;brittleness;constitutive relation;internal crack

 三维打印半透明材料本构关系及应用探讨_刘华博.pdf

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