Flip-chip interconnect technology in optoelectronics device packaging

Abstract：The requirements for the substrate and the solder are analyzed in the flip_chip technology used in photoelectronics device packaging. The solder pump structure for the flip chip bonding of the laser diode and the photoelectric detector are designed and fabricated in the silicon substrate, and the die bonding tests are implemented by using the automatic die bonder. The results demonstrate that the flip chip technology can implement high precise and reliable interconnect between the chip and the substrate. The technology used in the photoelectric device can realize miniaturization and batch production of optical devices, and can highly improve the transmitting speed of the optical transceiver modules.

Keyword：optoelectronics device packaging; flipchip bonding;Silicon board; pump;